Kiriform Pressure Sensors

What if we could develop scalable, cost-effective micro pressure sensors that overcome current limitations in sensitivity, scalability, and adaptability?

This project focuses on the development and miniaturization of Kiriform structures—a novel buckling-based deployable mechanism that transforms flat sheets into 3D structures through a simple and tunable rotational motion. By leveraging this unique property, the project aims to create micro pressure sensors that can be integrated with microelectronics, offering a scalable and high-fidelity pressure sensing solution. The exploration includes various materials, such as polymers, metals, and composites, to optimize the sensors for different applications, ranging from medical devices to industrial monitoring systems.

The basic interaction module in this project is the conversion of linear motion into rotational motion within miniaturized Kiriform structures, enabling precise and responsive pressure sensing capabilities.

Pressure sensors are critical in both medical and industrial applications, but existing technologies face significant challenges related to scalability, sensitivity, and cost-effectiveness. Current pressure sensors often require complex manufacturing processes and are limited in their adaptability to different sizes and environments. There is a clear need for innovative solutions that address these limitations and enable broader adoption and effectiveness in critical applications.

The project involves developing and optimizing methods for miniaturizing and manufacturing 3D Kiriform structures. Finite Element Analysis (FEA) simulations will be used to test and determine the best materials for these structures, ensuring mechanical stability and responsiveness at micrometer and millimeter scales. The sensors will be integrated with microelectronics through advanced techniques to ensure constant contact, reliable performance, and accurate signal conversion. The process will be optimized for scalability, allowing for mass production of these sensors across various materials and applications.

Our approach is novel because it combines the unique properties of Kiriform structures with microelectronics to create a versatile, scalable, and cost-effective pressure sensing solution. This innovation has the potential to revolutionize pressure sensor technology, enabling its application across a wide range of fields, including medical, industrial, consumer products, and aerospace. The project not only addresses current limitations but also opens new avenues in the design and application of pressure sensors and other mechanical devices, contributing to advancements in both technology and education.